The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

May. 18, 2021
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chen-Hsiu Lin, New Taipei, TW;

Tsung-Kang Ying, New Taipei, TW;

Erh-Chan Hsu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 29/20 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/568 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/08 (2013.01); H01L 24/48 (2013.01); H01L 33/62 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/48145 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.


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