The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

May. 22, 2019
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Chak Hau Pang, Fanling, HK;

JuZuo Sheng, Huizhou, CN;

Yue Kwong Lau, Kowloon, HK;

Zhenyu Zhong, Tseung Kwan O, HK;

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/505 (2013.01); H01L 33/58 (2013.01);
Abstract

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.


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