The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Sep. 10, 2021
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Agatino Minotti, Mascalucia, IT;
Assignee:
STMICROELECTRONICS S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 24/32 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24247 (2013.01); H01L 2224/244 (2013.01); H01L 2224/2501 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15153 (2013.01);
Abstract
Packaged device having a carrying base; an accommodation cavity in the carrying base; a semiconductor die in the accommodation cavity, the semiconductor die having die pads; a protective layer, covering the semiconductor die and the carrying base; first vias in the protective layer, at the die pads; and connection terminals of conductive material. The connection terminals have first connection portions in the first vias, in electrical contact with the die pads, and second connection portions, extending on the protective layer, along a side surface of the packaged device.