The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jan. 20, 2022
Infineon Technologies Ag, Neubiberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a first power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the first power electronics carrier, and a first pair of metal pads that are immediately laterally adjacent one another and are low-voltage difference nodes of the semiconductor package, a second pair of metal pads that are immediately laterally adjacent one another and are high-voltage difference nodes of the semiconductor package, and an encapsulant body of electrically insulating material that encapsulates the power semiconductor die and the first and second pairs of metal pads, wherein the first pair of the metal pads are laterally isolated from one another by a first minimum separation distance, and wherein the second pair of the metal pads are laterally isolated from one another by a second minimum separation distance that is greater than the first minimum separation distance.