The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
May. 04, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jeonil Lee, Suwon-si, KR;
Jongmin Lee, Hwaseong-si, KR;
Jimin Choi, Seoul, KR;
Yeonjin Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor device includes a substrate including a first surface, and a second surface opposing the first surface. A via insulating layer extending through the substrate is disposed. A through-silicon via extending through the via insulating layer is disposed. The center of the through-silicon via is misaligned from the center of the via insulating layer. A blocking layer is disposed on the first surface. A first insulating layer is disposed on the blocking layer. A contact plug contacting the through-silicon via and extending through the first insulating layer and the blocking layer is disposed.