The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

May. 16, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kazunori Inoue, Nagaokakyo, JP;

Shintaro Otsuka, Nagaokakyo, JP;

Koichiro Kawasaki, Nagaokakyo, JP;

Hidefumi Nakanishi, Nagaokakyo, JP;

Masakazu Atarashi, Nagaokakyo, JP;

Masahiro Fukushima, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/08 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/08 (2013.01); H01L 23/52 (2013.01);
Abstract

An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.


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