The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Oct. 17, 2023
Applicant:

Northwestern University, Evanston, IL (US);

Inventors:

Mark C. Hersam, Wilmette, IL (US);

Jung-Woo Ted Seo, Naperville, IL (US);

Jian Zhu, Tianjin, CN;

Assignee:

NORTHWESTERN UNIVERSITY, Evanston, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02538 (2013.01); H01L 21/02551 (2013.01); H01L 21/02568 (2013.01); H01L 21/02601 (2013.01); H01L 21/02606 (2013.01); H01L 31/208 (2013.01);
Abstract

Printable inks based on a 2D semiconductor, such as MoS, and its applications in fully inkjet-printed optoelectronic devices are disclosed. Specifically, percolating films of MoSnanosheets with superlative electrical conductivity (10s m) are achieved by tailoring the ink formulation and curing conditions. Based on an ethyl cellulose dispersant, the MoSnanosheet ink also offers exceptional viscosity tunability, colloidal stability, and printability on both rigid and flexible substrates. Two distinct classes of photodetectors are fabricated based on the substrate and post-print curing method. While thermal annealing of printed devices on rigid glass substrates leads to a fast photoresponse of 150 μs, photonically annealed devices on flexible polyimide substrates possess high photoresponsivity exceeding 50 mA/W. The photonically annealed photodetector also significantly reduces the curing time down to the millisecond-scale and maintains functionality over 500 bending cycles, thus providing a direct pathway to roll-to-roll manufacturing of next-generation flexible optoelectronics.


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