The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Mar. 04, 2022
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Takayuki Ito, Yokkaichi, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/05 (2006.01); H01J 37/147 (2006.01); H01J 37/20 (2006.01); H01J 37/302 (2006.01); H01J 37/317 (2006.01); H01L 21/265 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01J 37/05 (2013.01); H01J 37/1478 (2013.01); H01J 37/20 (2013.01); H01J 37/3023 (2013.01); H01J 37/3171 (2013.01); H01L 21/26586 (2013.01); H01L 29/7836 (2013.01); H01J 2237/20207 (2013.01); H01J 2237/20285 (2013.01);
Abstract
A semiconductor manufacturing apparatus according to the present embodiment includes a stage on which a wafer can be placed. A separator separates a beam of impurities to be introduced into the wafer into an ion component and a neutral component. A controller switches the semiconductor manufacturing apparatus between a first mode and a second mode, where in the first mode, the ion component is introduced into the wafer and in the second mode, the neutral component is introduced into the wafer.