The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
May. 12, 2021
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 7/06 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01Q 7/08 (2006.01); H02J 7/00 (2006.01); H02J 50/10 (2016.01); H02J 50/70 (2016.01); H05K 7/20 (2006.01); H10N 10/00 (2023.01);
U.S. Cl.
CPC ...
H01F 27/2823 (2013.01); H01F 27/24 (2013.01); H01F 27/32 (2013.01); H01F 41/04 (2013.01); H01Q 7/06 (2013.01); H01Q 7/08 (2013.01); H02J 7/0044 (2013.01); H02J 50/10 (2016.02); H02J 50/70 (2016.02); H05K 7/20145 (2013.01); H10N 10/00 (2023.02);
Abstract
A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.