The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jan. 08, 2021
Connectec Japan Corporation, Myoko, JP;
Hiroshi Komatsu, Myoko, JP;
Daisuke Sakai, Myoko, JP;
CONNECTEC JAPAN CORPORATION, Myoko, JP;
Abstract
Provided is an unprecedented and innovative wiring formation method with which it is possible to form transfer wiring using a transfer mold on a substrate having recesses and protrusions on the surface, without carrying out a smoothing process. The wiring formation method includes filling recesses () arranged in a prescribed pattern in a transfer mold () having the recesses () with an electroconductive member (), laying the transfer mold () filled with the electroconductive member () over the surface of a substrate () having recesses and protrusions, transferring the electroconductive member () to the surface of the substrate (), and forming a wiring part () on the surface of the substrate () using the electroconductive member (), wherein a soft mold having a durometer A hardness of 40-70 is used as the transfer mold ().