The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Mar. 06, 2023
Applicant:

Gold Bond Building Products, Llc, Charlotte, NC (US);

Inventors:

Jeff Hawk, Mitchell, IN (US);

Tommy Wilson, Rock Hill, SC (US);

Michael N. Blades, Indian Land, SC (US);

Joseph J. Bailey, Charlotte, NC (US);

Brian G. Randall, Charlotte, NC (US);

Assignee:

Gold Bond Building Products, LLC, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E04B 1/84 (2006.01); C01F 11/46 (2006.01); E04B 1/86 (2006.01); E04B 2/74 (2006.01); E04C 2/04 (2006.01); E04C 2/288 (2006.01); G10K 11/168 (2006.01); B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
E04B 1/8409 (2013.01); E04B 1/86 (2013.01); E04B 2/7409 (2013.01); E04C 2/043 (2013.01); E04C 2/288 (2013.01); G10K 11/168 (2013.01); B32B 9/002 (2013.01); B32B 2607/00 (2013.01); C01F 11/46 (2013.01); E04B 2001/8461 (2013.01);
Abstract

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer inner surface opposite the gypsum layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, a second encasing layer disposed at the first sound damping layer inner surface, and a second sound damping layer disposed at the second encasing layer opposite the first sound damping layer inner surface.


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