The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Mar. 19, 2020
Applicant:
Nippon Steel Corporation, Tokyo, JP;
Inventors:
Assignee:
NIPPON STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/06 (2006.01); B21D 22/02 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/52 (2006.01); C22C 38/54 (2006.01); C22C 38/58 (2006.01);
U.S. Cl.
CPC ...
C22C 38/58 (2013.01); B21D 22/022 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/06 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/52 (2013.01); C22C 38/54 (2013.01); C21D 2211/001 (2013.01);
Abstract
A hot-stamping formed body has a predetermined chemical composition, in which an average grain size of prior austenite grains in a microstructure is 5.0 μm or less, and an average Mn concentration at grain boundaries of the prior austenite grains is 1.0 mass % or less. The hot-stamping formed body may be provided with a plating layer on the surface thereof, or may have a softened region in a portion thereof.