The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jun. 13, 2022
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Stefanie Stapf, Essen, DE;
Alexandra Lieske, Duesseldorf, DE;
Jordan Gutierrez Diaz, Duesseldorf, DE;
Thomas Moeller, Duesseldorf, DE;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); B32B 2310/021 (2013.01); B32B 2311/24 (2013.01); C09J 2463/00 (2013.01);
Abstract
The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.