The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Dec. 02, 2016
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sang Woo Kim, Daejeon, KR;

Seung Hee Lee, Daejeon, KR;

Ki Ho Ahn, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/16 (2006.01); C08G 73/10 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/40 (2006.01); C08G 69/38 (2006.01);
U.S. Cl.
CPC ...
C08G 73/16 (2013.01); C08G 73/1007 (2013.01); C08G 73/1053 (2013.01); C08G 73/1071 (2013.01); C08K 3/40 (2013.01); C08G 69/38 (2013.01); C08G 73/105 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01);
Abstract

The present application relates to a polymerizable composition, a prepolymer, a phthalonitrile resin, a composite, a process for preparing the same, and a use thereof. The present application can provide a polymerizable composition comprising a curing agent which has excellent heat resistance and does not cause defects such as voids that may adversely affect physical properties. In addition, the present application allows for the polymerizable composition to exhibit appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties. The present application can provide a resin having both advantages of a phthalonitrile resin and a polyimide by curing a phthalonitrile compound as a raw material monomer with a curing agent having a polyimide structure.


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