The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Feb. 02, 2022
Applicant:
Raytheon Technologies Corporation, Farmington, CT (US);
Inventors:
Wayde R. Schmidt, Pomfret Center, CT (US);
Paul Sheedy, Bolton, CT (US);
Assignee:
RTX CORPORATION, Farmington, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/64 (2006.01); C04B 35/626 (2006.01); C04B 35/628 (2006.01); C04B 35/657 (2006.01); F01D 5/02 (2006.01); F01D 5/14 (2006.01); F01D 9/02 (2006.01); F01D 25/08 (2006.01); F01D 25/24 (2006.01); F23R 3/00 (2006.01);
U.S. Cl.
CPC ...
C04B 35/64 (2013.01); C04B 35/6269 (2013.01); C04B 35/62863 (2013.01); C04B 35/62884 (2013.01); C04B 35/62886 (2013.01); C04B 35/657 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/5244 (2013.01); C04B 2235/5256 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/614 (2013.01); C04B 2235/616 (2013.01); C04B 2235/666 (2013.01); C04B 2235/667 (2013.01); C04B 2235/9669 (2013.01); F01D 5/02 (2013.01); F01D 5/147 (2013.01); F01D 9/02 (2013.01); F01D 25/08 (2013.01); F01D 25/24 (2013.01); F05D 2230/22 (2013.01); F05D 2300/21 (2013.01); F05D 2300/2261 (2013.01); F05D 2300/228 (2013.01); F23R 3/002 (2013.01);
Abstract
A method of manufacturing a CMC structure includes infiltrating a porous substrate with a composite material and performing a first densification on the infiltrated porous substrate, forming a first densified porous substrate, wherein the first densification includes techniques selected from the group of techniques comprising photonic curing, photonic sintering, pulsed thermal heating, or combinations thereof.