The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Sep. 18, 2020
Applicants:

Shin-etsu Quartz Products Co., Ltd., Tokyo, JP;

Heraeus Quarzglas Gmbh & Co. KG, Hanau, DE;

Inventors:

Kazuhiro Yamaguchi, Tokyo, JP;

Daiki Fujita, Yamagata, JP;

Yoshihiro Harada, Yamagata, JP;

Toru Segawa, Fukushima, JP;

Tomonori Watanabe, Fukushima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 19/06 (2006.01); C03B 33/07 (2006.01); C03B 33/08 (2006.01);
U.S. Cl.
CPC ...
C03B 19/066 (2013.01); C03B 33/07 (2013.01); C03B 33/082 (2013.01);
Abstract

Provided is a heat reflective member, which is prevented from braking even in a high-temperature environment. It generates no dust in use, and can be washed with a chemical liquid. The heat reflective member has a laminated structure in which quartz glass layers are formed on an upper surface and a lower surface of a siliceous sintered powder layer. The heat reflective member includes: an impermeable layer which is formed at a portion of the siliceous sintered powder layer at an end portion of the heat reflective member, which has a thickness at least larger than half of a thickness of the siliceous sintered powder layer, and through which a gas or a liquid is prevented from penetrating; and a buffer layer which is formed between the impermeable layer and the siliceous sintered powder layer, and which changes in density from the impermeable layer toward the sintered powder layer.


Find Patent Forward Citations

Loading…