The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Apr. 12, 2021
Applicant:
Sciosense B.v., AE Eindhoven, NL;
Inventors:
Willem Frederik Adrianus Besling, JN Eindhoven, NL;
Casper Van Der Avoort, Waalre, NL;
Coenraad Cornelis Tak, Waalre, NL;
Remco Henricus Wilhelmus Pijnenburg, Hoogeloon, NL;
Olaf Wunnicke, AE Eindhoven, NL;
Hendrik Bouman, Nijmegen, NL;
Assignee:
Sciosense B.V., AE Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/0023 (2013.01); G01D 11/245 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2203/032 (2013.01); B81C 2203/0785 (2013.01);
Abstract
A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.