The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Dec. 03, 2021
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventor:

Uwe Schneider, Cincinnati, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 13/15 (2006.01); A61F 13/49 (2006.01); B29C 65/00 (2006.01); B29C 65/08 (2006.01); B29C 65/74 (2006.01); B29C 65/78 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
B29C 66/83411 (2013.01); B29C 65/086 (2013.01); B29C 65/74 (2013.01); B29C 65/7894 (2013.01); B29C 66/45 (2013.01); B29C 66/7392 (2013.01); A61F 13/15593 (2013.01); A61F 13/15699 (2013.01); A61F 13/15707 (2013.01); A61F 13/15723 (2013.01); A61F 13/49 (2013.01); A61F 13/49009 (2013.01); A61F 2013/49025 (2013.01); B29L 2031/4878 (2013.01);
Abstract

The present disclosure relates to methods for making apertured elastic laminates that may be used as components of absorbent articles. The methods and apparatuses may be close coupled such that materials may advance directly between aperturing and bonding operations. Such close coupling of devices may help to more precisely control the positions of the apertures in substrates relative to positions of apertures opposing substrates and/or bonds in the assembled laminate. The methods and apparatuses herein may also provide the ability to orient protrusions or protuberances in the substrates created by the aperturing process so as to extend inward and away from both outer surfaces of the assembled laminate. In turn, the assembly processes may be conducted so as to help mitigate reductions in softness that might otherwise result from the aperturing process in the assembled laminate.


Find Patent Forward Citations

Loading…