The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Apr. 17, 2024
Applicant:

United Arab Emirates University, Al Ain, AE;

Inventors:

Waleed Ahmed, Al Ain, AE;

Muthanna Aziz, Al Ain, AE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/336 (2017.01); B33Y 50/02 (2015.01); G06F 30/23 (2020.01); G06F 30/27 (2020.01); G06F 113/10 (2020.01); G06F 119/02 (2020.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 50/02 (2014.12); G06F 30/23 (2020.01); G06F 30/27 (2020.01); G06F 2113/10 (2020.01); G06F 2119/02 (2020.01);
Abstract

There is disclosed an improved additive manufacturing method and system for the production of components and structures, which integrates real-time monitoring and integrity diagnosis systems directly into the manufacturing process. The method introduces smart slicing technique by which smart sensor network layers (SNL) are embedded into sliced layers of a 3-D model at critical points during component design. The critical points are identified by structural analyses of the component using Finite Element Analysis (FEA). A Smart Extrusion and Mixing Module (SEMM) produces both primary printing material and conductive material for SNL layers. The SEMM operates in a direct extrusion mode for primary material and in a mixing and extrusion mode for conductive material. An Artificial Intelligence Single Board Computer (AISBC) manages the printing process and communication with SNL layers. Defect detection occurs in real-time during manufacturing, aided by a scanning module powered by an AI algorithm.


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Ahmed, Waleed. (2024). Method and system for integrating real-time monitoring and integrity diagnosis into component manufacturing (U.S. Patent No. 12179434). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12179434

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