The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jul. 14, 2022
Mitsubishi Chemical Corporation, Tokyo, JP;
Yukihiro Mizutori, Tokyo, JP;
Junji Kanehagi, Tokyo, JP;
Yasushi Watanabe, Tokyo, JP;
Tadao Samejima, Tokyo, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
Provided is a useful improvement in a manufacturing method of a CF-SMC using a partially split continuous carbon fiber bundle. The manufacturing method of an SMC of the present invention includes (i) a step of drawing out a continuous carbon fiber bundle () from a package, the continuous carbon fiber bundle () having a filament number of NK and partially split into n sub-bundles in advance, (ii) a step of chopping the continuous carbon fiber bundle () drawn out from the package with a rotary cutter () into chopped carbon fiber bundles (), and (iii) a step of depositing the chopped carbon fiber bundles () on a carrier film () traveling below the rotary cutter () to form a carbon fiber mat (). In the manufacturing method, due to a fragmentation processing, in which at least some of the chopped carbon fiber bundles before being deposited on the carrier film () are fragmented by being brought into contact with a rotating body, a distribution of the filament number of the chopped carbon fiber bundles in the carbon fiber mat () is made different from that when the fragmentation processing is not performed.