The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Oct. 13, 2020
Sumco Corporation, Tokyo, JP;
Ryoya Terakawa, Saga, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
Provided is a method of transferring a semiconductor wafer to a single-side polishing apparatus without forming scratches on the surface of the semiconductor wafer. The method includes: starting to splay the liquid from each spray hole; placing the semiconductor wafer on the retainer portion to hold a surface of the semiconductor wafer by suction without contact, and raising the tray to attach the semiconductor wafer to the polishing head, wherein a period of time from a point at which the semiconductor wafer is held by the retainer portion to a point at which the attaching of the semiconductor wafer W to the polishing head is completed is 5 s or more, or wherein a ratio of a total area of the protrusions to an area of the semiconductor wafer is 15% or more.