The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Jun. 29, 2022
Applicant:

Bfly Operations, Inc., Guilford, CT (US);

Inventors:

Keith G. Fife, Palo Alto, CA (US);

Jianwei Liu, Fremont, CA (US);

Andrew Betts, Guilford, CT (US);

Assignee:

BFLY OPERATIONS, INC, Burlington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); A61B 8/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H10N 30/03 (2023.01);
U.S. Cl.
CPC ...
A61B 8/4483 (2013.01); A61B 8/54 (2013.01); A61B 8/56 (2013.01); B06B 1/0622 (2013.01); B81B 7/0048 (2013.01); B81C 1/00261 (2013.01); H10N 30/03 (2023.02);
Abstract

Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.


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