The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Mar. 27, 2023
Huazhong University of Science and Technology, Wuhan, CN;
Zhiqiang Wang, Wuhan, CN;
Yu Liao, Wuhan, CN;
Guoqing Xin, Wuhan, CN;
Xiaojie Shi, Wuhan, CN;
Yong Kang, Wuhan, CN;
Huazhong University of Science and Technology, Wuhan, CN;
Abstract
The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.