The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jun. 01, 2023
Applicant:
Mts Ip Holdings Ltd, Grand Cayman, KY;
Inventors:
Luke Gregory, Mercer Island, WA (US);
Jimil Shah, Wylie, TX (US);
Ethan Schmitz, Saint Paul, MN (US);
Richard Eiland, Austin, TX (US);
Assignee:
MTS IP Holdings Ltd, George Town, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20236 (2013.01); H01L 23/473 (2013.01);
Abstract
Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.