The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Mar. 07, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Takahiro Kitazume, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3478 (2013.01); H01L 21/60 (2021.08); H01L 23/12 (2013.01); H01L 24/13 (2013.01); H05K 3/363 (2013.01); H01L 2021/60097 (2013.01);
Abstract
An electronic component module includes a substrate including a first main surface and a second main surface, and using a side near the second main surface as a mounting side, an external terminal by a solder ball made of first solder, on the second main surface, and a first electronic component mounted by using second solder, on the first main surface, and a melting point of the first solder is higher than a melting point of the second solder.