The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Apr. 03, 2020
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
John E. Rogers, Owens Cross Roads, AL (US);
John D. Williams, Decatur, AL (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H05K 1/0271 (2013.01); H05K 1/0393 (2013.01); H05K 1/05 (2013.01); H05K 1/115 (2013.01); H05K 1/189 (2013.01); H05K 2201/0183 (2013.01); H05K 2201/05 (2013.01); H05K 2201/093 (2013.01);
Abstract
A flexible electronics assembly including a substrate including one or more dielectrics. A cavity is formed within the substrate. A first ground plane is secured to the substrate. One or more stress channels are formed through one or more portions of the substrate and the first ground plane. An electronics component is disposed within the cavity.