The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jan. 22, 2020
Applicant:

Molex, Llc, Lisle, IL (US);

Inventors:

Victor Zaderej, Wheaton, IL (US);

Alan Han, Chicago, IL (US);

Richard Fitzpatrick, Chicago, IL (US);

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); H01R 13/52 (2006.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01R 13/665 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H05K 1/144 (2013.01); H05K 1/18 (2013.01); H05K 3/007 (2013.01); H05K 3/341 (2013.01); H05K 3/368 (2013.01); H01R 13/5202 (2013.01); H05K 3/0014 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01);
Abstract

In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.


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