Semiconductor chip integrated device manufacturing method, semiconductor chip integrated device, semiconductor chip integrated device assembly, semiconductor chip ink, and semiconductor chip ink ejection device

Abstract

A liquid-droplet-like semiconductor chip inkcontains a liquidand semiconductor chips, each of which has a first electrode and a second electrod on the upper surface and the lower surface and is configured such that the second electrode side is more strongly attracted to a magnetic field. The semiconductor chip inkis supplied to a chip joining part on a lower electrodewhich is formed on a mounting substrate, the second electrode side of the semiconductor chipsin the semiconductor chip inkare attracted by a magnetic force by an external magnetic field so as to make contact with the chip joining part, and thereafter is electrically and mechanically joined to the chip joining part by using soldering and the like. Thereafter an upper electrode in which a plurality of branch line parts or a single branch line part are extended from a main line part so as to cover the chip joining part is formed, and the semiconductor chipsare connected between the lower electrodeand an upper electrode, whereby a semiconductor chip integrated device is manufactured.