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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12176384 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Aug. 16, 2023

Methods of parallel transfer of micro-devices using treatment

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Manivannan Thothadri, Mountain View, CA (US);

Arvinder Chadha, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Jack S Chen

Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/60 (2010.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H01L 33/20 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/60 (2013.01); H05K 3/0026 (2013.01); H05K 3/305 (2013.01); H05K 13/0015 (2013.01); H05K 13/0069 (2013.01); H05K 13/0469 (2013.01); H01L 33/20 (2013.01); H01L 33/48 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A method of transferring micro-devices includes selectively treating a first adhesive layer to form a treated portion and an untreated portion while micro-devices are attached the first adhesive layer. A second adhesive layer on a second surface is placed to abut the micro-devices. The first adhesive layer is exposed to illumination in a region that overlaps at least some of the treated portion and at least some of the untreated portion. Exposing the first adhesive layer to illumination neutralizes the at least some of the untreated portion to create a neutralized portion that is less adhesive than an exposed area of the treated portion. The first surface is separated from the second surface such that micro-devices in the treated portion remain attached to the first surface and micro-devices in the neutralized portion are attached to the second surface and separate from the first surface.

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