The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 30, 2018
Applicant:
Proterial, Ltd., Tokyo, JP;
Inventors:
Junya Nishina, Osaka, JP;
Masaaki Ishio, Osaka, JP;
Assignee:
Hitachi Metals, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); B23K 20/04 (2006.01); H01B 13/00 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 103/12 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/37 (2013.01); B23K 20/04 (2013.01); H01B 1/02 (2013.01); H01B 13/0026 (2013.01); H01L 24/35 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); H01L 23/49524 (2013.01); H01L 2224/352 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/37155 (2013.01); H01L 2224/3716 (2013.01); H01L 2224/37541 (2013.01); H01L 2224/3756 (2013.01); H01L 2224/37565 (2013.01); H01L 2224/37639 (2013.01); H01L 2224/37647 (2013.01); H01L 2224/37655 (2013.01);
Abstract
An electrical connection member () includes a clad material () including at least both a first Cu layer () made of a Cu material and a low thermal expansion layer () made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other.