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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12176272 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Nov. 17, 2022

Semiconductor package with wettable flank

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Hui Min Ler, Seremban, MY;

Soon Wei Wang, Seremban, MY;

Chee Hiong Chew, Seremban, MY;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);

Attorney:

Adam R. Stephenson, LTD.

Primary Examiner:

Caleb E Henry

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49575 (2013.01);
Abstract

Implementations of the semiconductor package may include a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall. Implementations of the semiconductor package may include a first lead and a second lead extending from the first sidewall and a first half-etched tie bar directly coupled to the first lead. An end of the first half-etched tie bar may be exposed on the third sidewall of the semiconductor package. Implementations of the semiconductor package may also include a second half-etched tie bar directly coupled to the second lead. An end of the second half-etched tie bar may be exposed on the fourth sidewall. An end of the first lead and an end of the second lead may each be electroplated. The first die flag and the second die flag may be electrically isolated from the first lead and the second lead.

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