The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Dec. 20, 2022
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Viljami Pore, Helsinki, FI;

Zecheng Liu, Helsinki, FI;

Assignee:

ASM IP Holding B.V., Almere, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01L 21/67069 (2013.01); H01L 29/0649 (2013.01); H01J 2237/3341 (2013.01);
Abstract

There is provided a method of filling one or more recesses by providing the substrate in a reaction chamber and introducing a first reactant to the substrate with a first dose, introducing a second reactant to the substrate with a second dose, wherein the first and the second doses overlap in an overlap area where the first and second reactants react and leave an initially substantially unreacted area where the first and the second areas do not overlap; introducing a third reactant to the substrate with a third dose, the third reactant reacting with the first or second reactant to form deposited material; and etching the deposited material. An apparatus for filling a recess is also disclosed.


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