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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12176239 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Sep. 29, 2023

Parallel assembly of discrete components onto a substrate

Applicant:

Kulicke & Soffa Netherlands B.v., Eindhoven, NL;

Inventors:

Val Marinov, Fargo, ND (US);

Ronn Kliger, Cambridge, MA (US);

Matthew R. Semler, Fargo, ND (US);

Assignee:

KULICKE & SOFFA NETHERLANDS B.V., Eindhoven, NL;

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23K 26/067 (2006.01); B23K 26/354 (2014.01); B23K 26/36 (2014.01); H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); G02B 27/10 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B23K 26/0673 (2013.01); B23K 26/354 (2015.10); B23K 26/36 (2013.01); H01L 21/67115 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); G02B 27/1086 (2013.01); H01L 33/0095 (2013.01); H01L 33/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Find Patent Forward Citations

Marinov, Val. (2024). Parallel assembly of discrete components onto a substrate (U.S. Patent No. 12176239). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12176239

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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