The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Feb. 10, 2021
Tomoegawa Co., Ltd., Tokyo, JP;
Tomoya Hagihara, Shizuoka, JP;
Jun Tochihira, Yaizu, JP;
TOMOEGAWA CORPORATION, Tokyo, JP;
Abstract
An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.