The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

May. 31, 2019
Applicant:

Texas State University, San Marcos, TX (US);

Inventors:

Raju Ahmed, San Marcos, TX (US);

Edwin L. Piner, San Marcos, TX (US);

Assignee:

Texas State University, San Marcos, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 16/27 (2006.01); C23C 16/34 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C30B 25/18 (2006.01); C30B 29/04 (2006.01); C30B 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 23/373 (2006.01); H01L 29/20 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4803 (2013.01); C23C 16/27 (2013.01); C23C 16/345 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); C30B 25/183 (2013.01); C30B 25/186 (2013.01); C30B 29/04 (2013.01); C30B 29/406 (2013.01); H01L 21/02381 (2013.01); H01L 21/02458 (2013.01); H01L 21/02488 (2013.01); H01L 21/0254 (2013.01); H01L 21/02647 (2013.01); H01L 21/7806 (2013.01); H01L 23/3732 (2013.01); H01L 29/2003 (2013.01); H01L 29/7786 (2013.01);
Abstract

A method for incorporating semiconductors on a diamond substrate. A buffer layer (e.g., GaN) is grown on a transition layer (e.g., AlN/AlGaN) residing on a substrate. A silicon nitride layer is then grown on the buffer layer. After selectively seeding diamond on the silicon nitride layer, the selective seeding of the diamond is dry etched to form regions with seeded diamond and regions without seeded diamond. The silicon nitride is selectively etched in the regions without seeded diamond and diamond is grown in the regions with seeded diamond forming regions of diamond. Additional Group III-nitride semiconductor material (e.g., GaN) is grown in the etched regions without seeded diamond to fill such regions to reach a level of the regions with diamond. An epitaxial overgrowth of the Group III semiconductor material at and above the level of the regions with diamond is then performed.


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