The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Aug. 18, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Ha Jeong Kim, Suwon-si, KR;
Kangha Lee, Suwon-si, KR;
Jun Hyeong Kim, Suwon-si, KR;
Eui Hyun Jo, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.