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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12174781 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Apr. 17, 2023

Monolithically integrated system on chip for silicon photonics

Applicant:

Marvell Asia Pte Ltd, Singapore, SG;

Inventors:

Radhakrishnan L. Nagarajan, San Jose, CA (US);

Chao Xu, Thousand Oaks, CA (US);

Assignee:

MARVELL ASIA PTE LTD, Singapore, SG;

Attorney:
Primary Examiner:

David E Martinez

Int. Cl.
CPC ...
G06F 15/78 (2006.01); G02B 6/12 (2006.01); G06F 13/364 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); H04B 10/40 (2013.01); H04B 10/69 (2013.01); H04B 10/80 (2013.01); H04L 1/00 (2006.01); H04L 25/03 (2006.01); H04L 27/00 (2006.01); H04L 5/14 (2006.01); H04L 27/02 (2006.01); H04L 27/18 (2006.01); H04L 27/34 (2006.01);
U.S. Cl.
CPC ...
G06F 15/7817 (2013.01); G02B 6/12004 (2013.01); G06F 13/364 (2013.01); G06F 13/4072 (2013.01); G06F 13/42 (2013.01); G06F 13/4282 (2013.01); H04L 1/0003 (2013.01); H04L 25/03006 (2013.01); H04L 27/0008 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12097 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12142 (2013.01); H04L 5/14 (2013.01); H04L 25/03343 (2013.01); H04L 27/02 (2013.01); H04L 27/18 (2013.01); H04L 27/34 (2013.01);
Abstract

A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.

Find Patent Forward Citations

Nagarajan, Radhakrishnan. (2024). Monolithically integrated system on chip for silicon photonics (U.S. Patent No. 12174781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12174781

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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