The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jun. 21, 2023
Qualcomm Incorporated, San Diego, CA (US);
Santhosh Reddy Akavaram, Hyderabad, IN;
Prakhar Srivastava, Lucknow, IN;
Sridhar Anumala, Hyderabad, IN;
Ramacharan Sundararaman, San Jose, CA (US);
Sonali Jabreva, Firozabad, IN;
Khushboo Kumari, Hyderabad, IN;
Sanjay Verdu, Tirupati, IN;
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Methods and apparatuses are provided to reduce latencies associated with state transitions in die-to-die interconnect architectures. In one example, a physical layer of a die detects a first event indicating a transition to a lower power state. In response to the first event, the physical layer transitions to a lower power state where one or more clock configuration values are read from registers and stored in memory. The physical layer then detects a second event indicating a transition to an active state. In response to the second event, the physical layer reads the clock configuration values from the memory, and writes the clock configuration values to the registers. The physical layer then transitions to a power stabilization state, and remains in the power stabilization state for an amount of time to allow clocks to stabilize. The physical layer then transitions to a training state.