The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Oct. 16, 2020
Applicant:

Northeastern University, Boston, MA (US);

Inventors:

Salman A. Abbasi, Malden, MA (US);

Zhimin Chai, Revere, MA (US);

Ahmed Busnaina, Needham, MA (US);

Assignee:

Northeastern University, Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B82Y 40/00 (2013.01);
Abstract

A scalable printing process capable of printing microscale and nanoscale features for additively manufacturing electronics is provided. This fast, directed assembly-based approach selectively prints microscale and nanoscale features on both rigid and flexible substrates. The printing speed is much faster than state-of-the-art inkjet and flexographic printing, and the resolution is two orders of magnitude higher, with minimum feature size of 100 nm. Feature patterns can be printed over large areas and require no special limitations on the assembled materials. Hydrophilic/hydrophobic patterns are used to direct deposition of nanomaterials to specific regions or to selectively assemble polymer blends to desired sites in a one-step process with high specificity and selectively. The selective deposition can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions. The methods and nanoscale patterned substrates can be used with polyelectrolytes, conductive polymers, colloids, and nanoparticles for application in electronics, sensors, energy, medical devices, and structural materials.


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