The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Sep. 22, 2023
Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;
Guangchao Du, Shandong, CN;
Yongzheng Tang, Shandong, CN;
Tao Wu, Shandong, CN;
Jianwei Mu, Shandong, CN;
Shaoshuai Sui, Shandong, CN;
Jihong Han, Shandong, CN;
Sitao Chen, Shandong, CN;
Qian Shao, Shandong, CN;
Bangyu Yu, Shandong, CN;
Benzheng Dong, Shandong, CN;
Xiangxun Sun, Shandong, CN;
Fabu Xu, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao, CN;
Abstract
An optical module includes a shell, a circuit board, a base, a laser assembly, a silicon optical chip and a protective cover. The laser assembly and the silicon optical chip are located on the base. The protective cover covers on the circuit board. The laser assembly and a wiring region of the laser assembly and/or the silicon optical chip and a wiring region of the silicon optical chip are encapsulated between the protective cover and the circuit board. The shell includes at least one heat conduction column, the at least one heat conduction column is disposed on an inner wall of the shell and is in thermal conductive connection with the laser assembly and/or the silicon optical chip. The protective cover includes at least one escape opening that allow the at least one heat conduction column to pass and enter an inside of the protective cover.