The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Sep. 22, 2023
Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;
Guangchao Du, Shandong, CN;
Yongzheng Tang, Shandong, CN;
Tao Wu, Shandong, CN;
Jianwei Mu, Shandong, CN;
Shaoshuai Sui, Shandong, CN;
Jihong Han, Shandong, CN;
Sitao Chen, Shandong, CN;
Qian Shao, Shandong, CN;
Bangyu Yu, Shandong, CN;
Benzheng Dong, Shandong, CN;
Xiangxun Sun, Shandong, CN;
Fabu Xu, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao, CN;
Abstract
An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The circuit board is disposed between an upper shell and a lower shell of the shell. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly and the silicon optical chip are located on the base. An upper box of the laser assembly and the base are combined to provide a cavity. Conductive substrates of the laser assembly are at least partially located in the cavity. Laser chips of the laser assembly are located on the conductive substrates. An opening of the cavity is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and a slot of the cavity allows the conductive substrates or wires to extend out of the cavity.