The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jul. 18, 2019
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Toshifumi Mitsuyama, Tokyo, JP;

Akira Doi, Tokyo, JP;

Hitoshi Miyata, Tokyo, JP;

Tomohiro Shoji, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 21/26 (2006.01); G02B 21/16 (2006.01); G02B 21/28 (2006.01); G02B 21/30 (2006.01); G02B 21/36 (2006.01); B01L 7/00 (2006.01);
U.S. Cl.
CPC ...
G02B 21/26 (2013.01); G02B 21/16 (2013.01); G02B 21/28 (2013.01); G02B 21/30 (2013.01); G02B 21/36 (2013.01); B01L 7/52 (2013.01);
Abstract

An image capturing mechanism includes: an optical measurement unit for optically observing a sample; a temperature conditioning unit for heating or cooling the sample, the temperature conditioning unit being mounted on a table by means of a support member; and a moving mechanism for moving the table in order to photograph the sample. The temperature conditioning unit includes: a temperature conditioning part for heating or cooling the sample, abutted on one face of a Peltier device; a heat conducting member abutted on the other face of the Peltier device; and the support member for holding the temperature conditioning part and the heat conducting member and securing the temperature conditioning part and the heat conducting member on the table. At least the heat conducting member is connected to a cooling means, and the thermal conductivity of the support member is low relative to the thermal conductivity of the heat conducting member.


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