The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Sep. 04, 2020
Jfe Steel Corporation, Tokyo, JP;
Ryosuke Masuda, Tokyo, JP;
Yoshinari Hashimoto, Tokyo, JP;
Akitoshi Matsui, Tokyo, JP;
Shugo Morita, Tokyo, JP;
Tatsuro Hayashida, Tokyo, JP;
Taiga Koriyama, Tokyo, JP;
Miho Sato, Tokyo, JP;
JFE STEEL CORPORATION, Tokyo, JP;
Abstract
An in-mold solidified shell thickness estimation apparatus includes: an input device; a model database configured to store a model formula and a parameter related to a solidification reaction of a molten steel inside a mold of a continuous casting facility; and a heat transfer model calculator configured to estimate an in-mold solidified shell thickness by calculating temperature distributions of the mold and of the molten steel inside the mold by solving a three-dimensional unsteady heat transfer equation. The heat transfer model calculator is configured to correct errors in a temperature of a mold copper plate and in an amount of heat removed from the mold, by correcting an overall heat transfer coefficient between the mold copper plate and the solidified shell.