The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jun. 04, 2021
Applicant:

Rtx Corporation, Farmington, CT (US);

Inventors:

Bryan P. Dube, Columbia, CT (US);

Joshua S. Lieberman, Jupiter, FL (US);

Assignee:

RTX CORPORATION, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D 5/28 (2006.01); F01D 9/04 (2006.01);
U.S. Cl.
CPC ...
F01D 5/284 (2013.01); F01D 9/041 (2013.01); F05D 2220/32 (2013.01); F05D 2230/31 (2013.01); F05D 2230/60 (2013.01); F05D 2240/12 (2013.01); F05D 2240/30 (2013.01);
Abstract

A method of assembling a ceramic matrix composite (CMC) component is provided. The method includes assessing which portions of the CMC component require relatively high-temperature capability and which portions require at least one of strength, thickness and increased thermal conductivity, making the portions that require the relatively high temperature capability with chemical vapor infiltration (CVI), making the portions that require the at least one of strength, thickness and increased thermal conductivity with melt infiltration (MI) and combining the portions that require the relatively high temperature capability with the CVI and the portions that require the at least one of strength, thickness and increased thermal conductivity with the MI.


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