The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Sep. 25, 2023
Applicant:
Eeja Ltd., Tokyo, JP;
Inventors:
Koichiro Inoue, Hiratsuka, JP;
Junko Tsuyuki, Hiratsuka, JP;
Shinji Maeda, Hiratsuka, JP;
Yusa Imanishi, Hiratsuka, JP;
Assignee:
EEJA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/48 (2006.01); C25D 3/62 (2006.01);
U.S. Cl.
CPC ...
C25D 3/48 (2013.01); C25D 3/62 (2013.01);
Abstract
A cyanide-free gold electroplating solution for forming gold deposits contains bismuth and compact-packed via-filling deposit with a U-shaped stacked structure in cross section inside drilled holes. A gold electroplating solution includes 15 g/L of gold (I) sodium sulfite (as gold element), 15 g/L of sodium sulfate, 50 g/L of sodium sulfite, 10 mg/L of thallium formate (as thallium element), 50 mg/L of bismuth nitrate (as bismuth element) and 1 g/L of sodium phosphate.