The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Mar. 25, 2021
Applicant:
Yupo Corporation, Tokyo, JP;
Inventors:
Masahiko Ueno, Ibaraki, JP;
Takuya Ikarashi, Ibaraki, JP;
Assignee:
YUPO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 7/02 (2019.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C09J 7/35 (2018.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 7/02 (2013.01); B32B 27/08 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); B32B 27/306 (2013.01); B32B 2250/24 (2013.01); B32B 2307/30 (2013.01); B32B 2307/31 (2013.01); B32B 2307/72 (2013.01); B32B 2519/00 (2013.01); C09J 2203/334 (2013.01); C09J 2301/122 (2020.08); C09J 2301/304 (2020.08); C09J 2301/414 (2020.08); C09J 2423/00 (2013.01); C09J 2433/00 (2013.01); C09J 2467/008 (2013.01);
Abstract
A heat-sensitive label that can achieve both sufficient adhesive strength and high recyclability is provided. A heat-sensitive label comprising a substrate layer and a heat sealing layer (A) on the substrate layer, wherein the heat sealing layer (A) comprises a heat sealing resin and a carboxylic anhydride-modified polyolefin resin (h); and a product MCh of an acid value M (mgKOH/g) of the carboxylic anhydride-modified polyolefin resin (h) and a content Ch (% by mass) of the carboxylic anhydride-modified polyolefin resin (h) in the heat sealing layer (A) is 1.5 to 6.0.