The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Dec. 09, 2021
Applicant:

Versiv Composites Limited, Kilrush, IE;

Inventors:

Jennifer Adamchuk, Marlborough, MA (US);

Dale Thomas, Rochdale, GB;

Meghann White, Bedford, NH (US);

Sethumadhavan Ravichandran, Shrewsbury, MA (US);

Gerard T. Buss, Bedford, NH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 11/04 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/381 (2018.01); C09J 11/04 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); C09J 2203/326 (2013.01); C09J 2301/41 (2020.08); C09J 2400/166 (2013.01); C09J 2427/00 (2013.01); C09J 2427/006 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01);
Abstract

The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.


Find Patent Forward Citations

Loading…