The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Aug. 13, 2019
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Maki Itoh, Ichihara, JP;

Akihiro Nakamura, Ichihara, JP;

Michitaka Suto, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 183/06 (2006.01); B01J 23/42 (2006.01); C09J 7/38 (2018.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); B01J 23/42 (2013.01); C09J 7/38 (2018.01); C09J 2301/122 (2020.08); C09J 2301/16 (2020.08); C09J 2483/00 (2013.01); C09J 2483/005 (2013.01); H04R 31/00 (2013.01);
Abstract

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G') at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.


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