The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Dec. 27, 2019
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08G 77/00 (2006.01); C08G 77/20 (2006.01); C08G 77/44 (2006.01); C08J 3/12 (2006.01); C08K 3/22 (2006.01); C08K 5/14 (2006.01); C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/20 (2013.01); C08G 77/44 (2013.01); C08G 77/80 (2013.01); C08J 3/12 (2013.01); C08K 3/22 (2013.01); C08K 5/14 (2013.01); C08K 9/06 (2013.01); C08G 2170/20 (2013.01); C08K 2003/2241 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/18 (2013.01);
Abstract

Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G'/G″), is 0.40 or more.


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