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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12173151 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Nov. 22, 2023

Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroaki Umehara, Fukushima, JP;

Fumito Suzuki, Fukushima, JP;

Jun Yasumoto, Osaka, JP;

Hiroharu Inoue, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Ana L Woodward

Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08J 5/24 (2006.01); C08K 5/00 (2006.01); C08K 5/3492 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08J 5/244 (2021.05); C08K 5/0025 (2013.01); C08K 5/34924 (2013.01); C08L 2203/16 (2013.01); C08L 2203/202 (2013.01); C08L 2205/025 (2013.01); C08L 2312/00 (2013.01);
Abstract

One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

Find Patent Forward Citations

Umehara, Hiroaki. (2024). Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board (U.S. Patent No. 12173151). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12173151

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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